Technical parameters/power supply voltage (DC): | 4.50V (min) |
|
Technical parameters/operating voltage: | 4.5V ~ 5.5V |
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Technical parameters/number of output interfaces: | 8 |
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Technical parameters/number of pins: | 24 |
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Technical parameters/memory capacity: | 114 B |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/power supply voltage: | 2.5V ~ 4V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 4.5 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 24 |
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Encapsulation parameters/Encapsulation: | EDIP-24 |
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Dimensions/Length: | 34.04 mm |
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Dimensions/Width: | 18.29 mm |
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Dimensions/Height: | 9.4 mm |
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Dimensions/Packaging: | EDIP-24 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Clock & Timing, Clock and Timing |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS12C887
|
Maxim Integrated | 功能相似 | DIP-24 |
IC RTC CLK/CALENDAR PAR 24-EDIP
|
||
DS12C887
|
Dallas Semiconductor | 功能相似 | DIP |
IC RTC CLK/CALENDAR PAR 24-EDIP
|
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