Chip AI consultant
Technical parameters/number of output interfaces: | 1 |
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Technical parameters/Input voltage (DC): | 16.0V (max) |
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Technical parameters/output voltage: | 2.5V ~ 6.5V |
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Technical parameters/output current: | 500 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/Static current: | 8 mA |
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Technical parameters/output capacitor type: | Tantalum |
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Technical parameters/voltage drop: | 500 mV |
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Technical parameters/adjusted output: | 1 |
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Technical parameters/Input voltage (Max): | 16 V |
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Technical parameters/input voltage (Min): | 2.5 V |
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Technical parameters/output voltage (Max): | 6.5 V |
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Technical parameters/output voltage (Min): | 2.5 V |
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Technical parameters/output current (Max): | 0.5 A |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/accuracy: | ±1 % |
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Technical parameters/input voltage: | 2.5V ~ 16V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Computers and computer peripherals, automation and process control, communication and networking |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MIC5209BM-TR
|
Microchip | 类似代替 | SOIC-8 |
IC REG LDO ADJ 0.5A 8SOIC
|
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MIC5209YM
|
MIC | 功能相似 | Surface Mount |
MICROCHIP MIC5209YM 芯片, 稳压器, LDO, 0.5A, SMD, 5209, SOIC8
|
||
MIC5209YM
|
Micrel | 功能相似 | SOIC-8 |
MICROCHIP MIC5209YM 芯片, 稳压器, LDO, 0.5A, SMD, 5209, SOIC8
|
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