Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | SOT-363 |
|
Dimensions/Packaging: | SOT-363 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BGA2717,115
|
NXP | 功能相似 | SOT-323-6 |
RF Amp Chip Single GP 6V 6Pin SC-88 T/R
|
||
SGA-2163Z
|
RFMD | 功能相似 | SOT-363 |
RF Amplifier IC Cellular, GSM, PCS, UMTS 0Hz ~ 5GHz SOT-363
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review