Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Rail, Tube |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ON Semiconductor | 功能相似 | SO-16 |
TEXAS INSTRUMENTS ULN2003AD 双极晶体管阵列, 达林顿, NPN, 50 V, 500 mA, SOIC
|
||
ULN2003AD
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS ULN2003AD 双极晶体管阵列, 达林顿, NPN, 50 V, 500 mA, SOIC
|
||
ULN2003AD
|
HTC | 功能相似 | SOP-16 |
TEXAS INSTRUMENTS ULN2003AD 双极晶体管阵列, 达林顿, NPN, 50 V, 500 mA, SOIC
|
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