Encapsulation parameters/Encapsulation: | DIP |
|
Dimensions/Packaging: | DIP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
HGSEMI | 类似代替 | DIP-16 |
TEXAS INSTRUMENTS CD4051BE 芯片, 4000系列 CMOS逻辑器件
|
||
|
|
Harris | 类似代替 | DIP |
TEXAS INSTRUMENTS CD4051BE 芯片, 4000系列 CMOS逻辑器件
|
||
CD4051BE
|
TI | 类似代替 | PDIP-16 |
TEXAS INSTRUMENTS CD4051BE 芯片, 4000系列 CMOS逻辑器件
|
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