Chip AI consultant
Technical parameters/power supply voltage (DC): | 4.75 V, 5.25 V (max) |
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Technical parameters/power supply current: | 30 mA |
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Technical parameters/number of channels: | 3 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/dissipated power: | 800 mW |
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Technical parameters/bandwidth: | 5.20 MHz |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 800 mW |
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Technical parameters/power supply voltage: | 4.75V ~ 5.25V |
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Technical parameters/power supply voltage (Max): | 5.25 V |
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Technical parameters/power supply voltage (Min): | 4.75 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.5 mm |
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Dimensions/Width: | 7.6 mm |
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Dimensions/Height: | 2.35 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | RGB To NTSC/PAL, Consumer Electronics, Computers and Computer Peripherals, Computers& Computer Peripherals, Consumer Electronics |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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