Chip AI consultant
Technical parameters/power supply voltage (DC): | 3.30 V, 3.60 V (max) |
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Technical parameters/number of pins: | 48 |
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Technical parameters/digits: | 16 |
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Technical parameters/access time: | 10 ns |
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Technical parameters/memory capacity: | 2000000 B |
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Technical parameters/access time (Max): | 10 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 2.4V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.4 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 48 |
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Encapsulation parameters/Encapsulation: | BGA-48 |
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Dimensions/Packaging: | BGA-48 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | Automotive, Industrial, Automotive, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IS61WV102416BLL-10MI
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Integrated Silicon Solution | 完全替代 | BGA-48 |
SRAM Chip Async Single 2.5V/3.3V 16M-Bit 1M x 16 10ns 48Pin TFBGA
|
||
IS61WV102416BLL-10MLI-TR
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Integrated Silicon Solution | 类似代替 | BGA-48 |
SRAM Chip Async Single 2.5V/3.3V 16M-Bit 1M x 16 10ns 48Pin TFBGA T/R
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