Technical parameters/power supply current: | 830 mA |
|
Technical parameters/number of circuits: | 4 |
|
Technical parameters/number of channels: | 4 |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 3.135V ~ 3.465V |
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Technical parameters/power supply voltage (Min): | 3.135 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Height: | 0.97 mm |
|
Dimensions/Packaging: | BGA-256 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Customs information/ECCN code: | 5A991.b.1 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CYP15G0401DXB-BGC
|
Cypress Semiconductor | 类似代替 | BGA-256 |
4通道HOTLink II收发器,Channel Bonding,8B/10B编码,10bit解码,冗余,BIST,JTAG
|
||
CYP15G0401DXB-BGXC
|
Cypress Semiconductor | 类似代替 | BGA-256 |
4通道HOTLink II收发器,Channel Bonding,8B/10B编码,10bit解码,冗余,BIST,JTAG
|
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