Technical parameters/number of pins: | 256 |
|
Technical parameters/RAM size: | 119808 B |
|
Technical parameters/number of inputs/outputs: | 186 Input |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Packaging: | BGA-256 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2014/06/16 |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC6SLX25-2FT256I
|
Xilinx | 完全替代 | LBGA-256 |
XC6SLX25 2FT256I 磨码
|
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