Technical parameters/digits: | 8 |
|
Technical parameters/access time: | 45 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 1.8 V |
|
Technical parameters/power supply voltage (Max): | 1.95 V |
|
Technical parameters/power supply voltage (Min): | 1.7 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 63 |
|
Encapsulation parameters/Encapsulation: | BGA-63 |
|
Dimensions/Packaging: | BGA-63 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S34MS02G100BHI003
|
Spansion | 完全替代 | VFBGA |
SLC NAND Flash Parallel 1.8V 2G-bit 256M x 8 63Pin BGA T/R
|
||
S34MS02G200TFI003
|
Cypress Semiconductor | 功能相似 | TSOP |
SLC NAND Flash Parallel 1.8V 2G-bit 256M x 8 48Pin TSOP-I T/R
|
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