Technical parameters/power supply voltage (DC): | 3.00V (min) |
|
Technical parameters/power supply current: | 110 mA |
|
Technical parameters/number of pins: | 56 |
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Technical parameters/digits: | 8, 16 |
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Technical parameters/access time: | 90 ns |
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Technical parameters/memory capacity: | 32000000 B |
|
Technical parameters/access time (Max): | 90 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 3V, 3.3V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 56 |
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Encapsulation parameters/Encapsulation: | TSOP-56 |
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Dimensions/Packaging: | TSOP-56 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | Industrial, consumer electronics, communication and networking, computers and computer peripherals |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL256P90TFCR10
|
Spansion | 类似代替 | TSOP |
闪存, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, TSOP, 56 引脚
|
||
S29GL256P90TFCR20
|
Spansion | 类似代替 | TSOP-56 |
闪存, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, TSOP, 56 引脚
|
||
S29GL256P90TFCR20
|
AMD | 类似代替 |
闪存, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, TSOP, 56 引脚
|
|||
S29GL256P90TFCR20
|
Cypress Semiconductor | 类似代替 | TSOP-56 |
闪存, 并行NOR, 256 Mbit, 32M x 8位, CFI, 并行, TSOP, 56 引脚
|
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