Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOP |
|
Dimensions/Packaging: | SOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S25FL512SAGMFIG13
|
Cypress Semiconductor | 功能相似 | SOIC |
NOR Flash Serial 3V/3.3V 512M-bit 512M/256M/128M x 1/2Bit/4Bit 8ns 16Pin SOIC W T/R
|
||
S25FL512SAGMFIG13
|
Spansion | 功能相似 | SOP |
NOR Flash Serial 3V/3.3V 512M-bit 512M/256M/128M x 1/2Bit/4Bit 8ns 16Pin SOIC W T/R
|
||
S25FL512SAGMFIR10
|
Cypress Semiconductor | 功能相似 | SOIC-16 |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, SOIC, 16 引脚
|
||
S25FL512SAGMFIR11
|
Spansion | 功能相似 | SOP |
闪存, MirrorBit Eclipse架构, 串行NOR, 512 Mbit, 64M x 8位, SPI, SOIC, 16 引脚
|
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