Technical parameters/Contact electroplating: | Gold |
|
Technical parameters/Insulation resistance: | 1000 MΩ |
|
Technical parameters/operating temperature (Max): | 90 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Dimensions/Length: | 3.5 mm |
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Dimensions/Width: | 3.5 mm |
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Dimensions/Height: | 4.35 mm |
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Physical parameters/contact material: | Beryllium Copper |
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Physical parameters/operating temperature: | -65℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | industry |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | lead-free |
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Compliant with standard/REACH SVHC version: | 2015/06/15 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1408496-1
|
TE Connectivity | 功能相似 | Through Hole |
AMP FROM TE CONNECTIVITY 1408496-1 射频/同轴连接器, MMCX
|
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