Technical parameters/power supply current: | 230 mA |
|
Technical parameters/digits: | 16 |
|
Technical parameters/access time: | 450 ps |
|
Technical parameters/access time (Max): | 0.45 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 1.7V ~ 1.9V |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 84 |
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Encapsulation parameters/Encapsulation: | BGA-84 |
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Dimensions/Packaging: | BGA-84 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Not Recommended |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: |
| |
Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Integrated Silicon Solution | 完全替代 | BGA-84 |
512M, 1.8V, DDR2, 32Mx16, 333MHz @ CL5, 84 ball BGA (8mmx12.5mm) RoHS, IT
|
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