Technical parameters/number of pins: | 676 |
|
Technical parameters/RAM size: | 256 KB |
|
Package parameters/number of pins: | 676 |
|
Encapsulation parameters/Encapsulation: | BBGA-676 |
|
Dimensions/Packaging: | BBGA-676 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC7Z030-1FBG676C
|
Xilinx | 完全替代 | FCBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z030系列, ARM Cortex-A9,667 MHz, FCBGA-676
|
||
XC7Z030-1FBG676C
|
Xilinx | 完全替代 | FCBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000 XC7Z030系列, ARM Cortex-A9,667 MHz, FCBGA-676
|
||
XC7Z030-1FFG676C
|
Xilinx | 完全替代 | FCBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9,667 MHz, FCBGA-676
|
||
XC7Z030-3FFG676E
|
Xilinx | 完全替代 | BBGA-676 |
PSoC/MPSoC微处理器, Zynq-7000可编程SoC系列, ARM Cortex-A9, 1 GHz, FCBGA-676
|
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