Chip AI consultant
Technical parameters/power supply voltage (DC): | 2.30V ~ 3.60V |
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Technical parameters/Input voltage (DC): | 1.70 V |
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Technical parameters/output voltage: | 5.5 V |
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Technical parameters/output current: | 30 A |
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Technical parameters/contact type: | SPST |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/drain source resistance: | 4 Ω |
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Technical parameters/digits: | 2 |
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Technical parameters/transmission delay time: | 200 ps |
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Technical parameters/polarity: | Non-Inverting |
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Technical Parameters/Voltage Wave Node: | 2.50 V, 3.30 V |
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Technical parameters/Static current: | 250 µA |
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Technical parameters/bandwidth: | 500 MHz |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 2.3V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.3 V |
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Technical parameters/input voltage: | 1.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | TSSOP-8 |
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Dimensions/Packaging: | TSSOP-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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