Technical parameters/RAM size: | 64 KB |
|
Technical parameters/FLASH memory capacity: | 512 KB |
|
Package parameters/number of pins: | 1152 |
|
Encapsulation parameters/Encapsulation: | BBGA-1152 |
|
Dimensions/Packaging: | BBGA-1152 |
|
Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | BBGA-1152 |
FPGA SmartFusion2 Family 146124 Cells 65nm Technology 1.2V 1152Pin FCBGA
|
||
|
|
Microsemi | 完全替代 | BBGA-1152 |
FPGA SmartFusion2 Family 146124 Cells 65nm Technology 1.2V 1152Pin FCBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review