Technical parameters/RAM size: | 64 KB |
|
Technical parameters/FLASH memory capacity: | 256 KB |
|
Encapsulation parameters/Encapsulation: | BGA-896 |
|
Dimensions/Packaging: | BGA-896 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | BGA-896 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
||
|
|
Microsemi | 完全替代 | BGA-896 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
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