Encapsulation parameters/Encapsulation: | BGA-484 |
|
Dimensions/Packaging: | BGA-484 |
|
Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S025T-FG484I
|
Microsemi | 完全替代 | FPBGA-484 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
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