Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -55 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 484 |
|
Encapsulation parameters/Encapsulation: | BGA-484 |
|
Dimensions/Packaging: | BGA-484 |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 完全替代 | BGA-484 |
Ic Fpga 267 i/o 484fbga
|
||
M2GL090TS-1FG484M
|
Microchip | 完全替代 | FPBGA-484 |
Ic Fpga 267 i/o 484fbga
|
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