Technical parameters/operating temperature (Max): | 100 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 1.14V ~ 2.625V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 325 |
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Encapsulation parameters/Encapsulation: | FCBGA-324 |
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Dimensions/Packaging: | FCBGA-324 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | lead-free |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 类似代替 | TFBGA-325 |
M2GL Series 1104KB RAM 180 I/O IGLOO2 FPGA - FCBGA-325
|
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