Technical parameters/dissipated power: | 1730 W |
|
Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | -10 ℃ |
|
Technical parameters/dissipated power (Max): | 1730 mW |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 56 |
|
Encapsulation parameters/Encapsulation: | TSSOP-56 |
|
Dimensions/Packaging: | TSSOP-56 |
|
Physical parameters/operating temperature: | -10℃ ~ 70℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN75LVDS83ADGG
|
TI | 完全替代 | TSSOP-56 |
FlatLinkâ ?? ¢变送器 FLATLINK⢠TRANSMITTER
|
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