Technical parameters/frequency: | 20 MHz |
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Technical parameters/power supply voltage (DC): | 2.30V (min) |
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Technical parameters/operating voltage: | 2.3V ~ 5.5V |
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Technical parameters/number of pins: | 8 |
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Technical parameters/clock frequency: | 20 MHz |
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Technical parameters/RAM size: | 64 b |
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Technical parameters/digits: | 8 |
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Technical parameters/dissipated power: | 800 mW |
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Technical parameters/FLASH memory capacity: | 1.75 KB |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/number of inputs/outputs: | 6 Input |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 800 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 1 |
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Technical parameters/power supply voltage: | 2.3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 4.9 mm |
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Dimensions/Width: | 3.9 mm |
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Dimensions/Height: | 1.25 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Computers & Computer Peripherals, Automotive, Automotive, Car use, computers and c Alternative material
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