Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC855TZQ50D4
|
NXP | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
MPC855TZQ50D4
|
Freescale | 类似代替 | BGA-357 |
NXP MPC855TZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
||
MPC860TCZQ50D4
|
Freescale | 完全替代 | BGA-357 |
NXP MPC860TCZQ50D4 芯片, 微处理器, 32位, 50MHZ, BGA-357
|
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