Technical parameters/number of contacts: | 10 |
|
Technical parameters/polarity: | Male |
|
Technical parameters/Contact electroplating: | Tin |
|
Technical parameters/rated voltage (AC): | 750 V |
|
Technical parameters/rated current: | 3 A |
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Technical parameters/Insulation resistance: | 1000 MΩ |
|
Technical parameters/number of rows: | 2 |
|
Technical parameters/number of pins: | 10 |
|
Technical parameters/Contact resistance: | 30 mΩ |
|
Technical parameters/number of plug and unplug cycles: | 50 |
|
Technical parameters/rated current (Max): | 3 A |
|
Technical parameters/operating temperature (Max): | 105 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | - |
|
Packaging parameters/pin spacing: | 2.54 mm |
|
Dimensions/Packaging: | - |
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Dimensions/Pin Spacing: | 2.54 mm |
|
Physical parameters/shell color: | Black |
|
Physical parameters/color: | Black |
|
Physical parameters/contact material: | Phosphor Bronze |
|
Physical parameters/operating temperature: | -40℃ ~ 105℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
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Other/Manufacturing Applications: | -, Industrial, Industrial |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67996-210HLF
|
Future Communications IC | 类似代替 |
AMPHENOL FCI 67996-210HLF Board-To-Board Connector, 2.54mm, 10Contacts, Header, BergStik 67996 Series, Through Hole, 2Rows
|
|||
67996-210HLF
|
Amphenol ICC | 类似代替 |
AMPHENOL FCI 67996-210HLF Board-To-Board Connector, 2.54mm, 10Contacts, Header, BergStik 67996 Series, Through Hole, 2Rows
|
|||
67997-410HLF
|
FCI Electronics | 类似代替 | 直插 |
AMPHENOL FCI 67997-410HLF 板至板连接器, 针座, 10路, 2排
|
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