Technical parameters/frequency: | 8 MHz |
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Technical parameters/power supply voltage (DC): | 2.70V (min) |
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Technical parameters/number of output interfaces: | 17 |
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Technical parameters/number of pins: | 20 |
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Technical parameters/clock frequency: | 8.00 MHz |
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Technical parameters/RAM size: | 256 x 8 |
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Technical parameters/digits: | 8 |
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Technical parameters/FLASH memory capacity: | 4096 B |
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Technical parameters/I/O pin count: | 17 |
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Technical parameters/memory capacity: | 4000 B |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/number of inputs/outputs: | 17 Input |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 300 mW |
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Technical parameters/power supply voltage: | 2.7V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 20 |
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Encapsulation parameters/Encapsulation: | SOIC-20 |
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Dimensions/Length: | 13 mm |
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Dimensions/Width: | 7.6 mm |
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Dimensions/Height: | 2.35 mm |
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Dimensions/Packaging: | SOIC-20 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead stand Alternative material
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