Chip AI consultant
Encapsulation parameters/Encapsulation: | * |
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Dimensions/Packaging: | * |
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Other/Series: | Automotive, AEC-Q100 MPC57xx |
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Other/Packaging: | * |
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Other/Package Case: | * |
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Other operating temperatures: | -40°C ~ 125°C (TA) |
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Other Supplier Device Packages: | * |
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Other/Speed: | 200MHz |
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Other/EEPROM Size: | - |
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Other/Core Processor: | e200z4 |
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Other/RAM Size: | 256K x 8 |
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Other/Program Memory Type: | FLASH |
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Other Peripherals: | DMA, LVD, POR, Zipwire |
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Other/Connectivity: | CAN, Ethernet, I2C, LIN, SCI, SPI, UART/USART |
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Other/Voltage Supply Vcc Vd: | 3.5 V ~ 5.5 V |
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Other/Core Size: | 32-Bit Tri-Core |
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Other/Program Memory Size: | 4MB (4M x 8) |
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Other/Data converters: | A/D 12b SAR, 16b Sigma-Delta |
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Other/Oscillator Type: | Internal |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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