Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | BGA-256 |
|
Dimensions/Packaging: | BGA-256 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
PEX8114-BC13BI
|
AVAGO Technologies | 功能相似 | BGA |
PCI Express to PCI/PCI-X Bridge 256Pin BGA
|
||
|
|
Broadcom | 功能相似 | LBGA |
PCI Express to PCI/PCI-X Bridge 256Pin BGA
|
||
PEX8114-BC13BIG
|
PLX | 功能相似 | BGA-256 |
PCI Express to PCI/PCI-X Bridge 256Pin BGA
|
||
|
|
Broadcom | 功能相似 | BGA |
PEX8114-BD13BI G
|
||
PEX8114-BD13BIG
|
PLX | 功能相似 | BGA-256 |
PEX8114-BD13BI G
|
||
PEX8114-BD13BIG
|
AVAGO Technologies | 功能相似 | BGA |
PEX8114-BD13BI G
|
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