Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube, Rail |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4040DIX3-2.1+T
|
Maxim Integrated | 功能相似 | SC-70-3 |
电压基准, 并联 - 固定, 2.048V, 1%Ref, ±15ppm/°C, SC-70-3
|
||
LM4050AIM3-2.5/NOPB
|
TI | 完全替代 | SOT-23-3 |
TEXAS INSTRUMENTS LM4050AIM3-2.5/NOPB 电压基准, 精准微功率, 分流 - 固定, LM4050系列, 2.5V, SOT-23-3
|
||
LM4050AIM3X-2.5
|
TI | 完全替代 | SOT-23-3 |
LM4050 / LM4050Q精密微功耗并联型电压基准 LM4050/LM4050Q Precision Micropower Shunt Voltage Reference
|
||
LM4050AIM3X-2.5/NOPB
|
National Semiconductor | 完全替代 | TSSOP |
50ppm/°C 精密微功耗并联电压基准 3-SOT-23 -40 to 85
|
||
TL4050A25IDBZR
|
TI | 功能相似 | SOT-23-3 |
精密微功耗并联型电压基准 PRECISION MICROPOWER SHUNT VOLTAGE REFERENCE
|
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