Technical parameters/rise/fall time: | 1 ns |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 150 mW |
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Technical parameters/rise time: | 4 ns |
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Technical parameters/isolation voltage: | 2500 Vrms |
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Technical parameters/input current (Min): | 10 μA |
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Technical parameters/forward voltage (Max): | 5 V |
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Technical parameters/descent time (Max): | 4 ns |
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Technical parameters/rise time (Max): | 4 ns |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 150 mW |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Industrial, Computers & Computer Peripherals, Industrial, computer and computer peripherals |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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