Technical parameters/rise/fall time: | 42ns, 12ns |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/forward voltage: | 1.3 V |
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Technical parameters/dissipated power: | 60/chmW |
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Technical parameters/rise time: | 0.042 µs |
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Technical parameters/isolation voltage: | 3.75 kV |
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Technical parameters/forward voltage (Max): | 1.6 V |
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Technical parameters/forward current (Max): | 10 mA |
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Technical parameters/descent time: | 0.012 µs |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 4.5V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Width: | 3.94 mm |
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Dimensions/Height: | 3.18 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Computers and Computer Peripherals, Signal Processing, Computers& Computer Peripherals, Power Management, Signal Processing, Power Management |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-063L
|
HP | 类似代替 |
BROADCOM LIMITED HCPL-063L 光电耦合器, SMD, 双路, 逻辑输出
|
|||
HCPL-063L
|
AVAGO Technologies | 类似代替 | SOIC-8 |
BROADCOM LIMITED HCPL-063L 光电耦合器, SMD, 双路, 逻辑输出
|
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