Chip AI consultant
Technical parameters/Input voltage (DC): | 1.50 V |
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Technical parameters/output voltage: | 20.0 V |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.50 V |
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Technical parameters/input current: | 5.00 mA |
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Technical parameters/dissipated power: | 210 mW |
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Technical parameters/data rate: | 5.00 Mbps |
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Technical parameters/rise time: | 30.0 ns |
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Technical parameters/isolation voltage: | 3750 Vrms |
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Technical parameters/forward voltage (Max): | 1.7 V |
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Technical parameters/forward current (Max): | 10 mA |
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Technical parameters/descent time: | 0.007 µs |
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Technical parameters/dissipated power (Max): | 210 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Packaging: | SOIC |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR), Cut Tape (CT) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-0211-500E
|
AVAGO Technologies | 功能相似 | SOIC |
BROADCOM LIMITED HCPL-0211-500E 光电耦合器, 数字式, 3.75KV, SOIC-8
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