Technical parameters/rise/fall time: | 50 ns |
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Technical parameters/output voltage: | 30.0 V |
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Technical parameters/output current: | 200 mA |
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Technical parameters/number of channels: | 1 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/forward voltage: | 1.5 V |
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Technical parameters/input current: | 12.0 mA |
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Technical parameters/dissipated power: | 250 mW |
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Technical parameters/rise time: | 50 ns |
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Technical parameters/isolation voltage: | 3.75 kV |
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Technical parameters/forward current: | 20 mA |
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Technical parameters/input current (Min): | 12 mA |
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Technical parameters/forward voltage (Max): | 1.8 V |
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Technical parameters/forward current (Max): | 12 mA |
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Technical parameters/descent time: | 50 ns |
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Technical parameters/descent time (Max): | 50 ns |
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Technical parameters/rise time (Max): | 50 ns |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 250 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 3.18 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Consumer Electronics, Motor Drive&Control, Consumer Electronics, Motor Drive& Control, HVAC |
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