Technical parameters/power supply current: | 5.3 mA |
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Technical parameters/number of circuits: | 1 |
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Technical parameters/number of channels: | 1 |
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Technical parameters/dissipated power: | 800 mW |
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Technical parameters/Common Mode Rejection Ratio: | 78 dB |
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Technical parameters/Input capacitance: | 1.50 pF |
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Technical parameters/conversion rate: | 300 V/μs |
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Technical parameters/gain bandwidth product: | 35 MHz |
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Technical parameters/input impedance: | 300 kΩ |
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Technical parameters/input compensation voltage: | 500 µV |
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Technical parameters/input bias current: | 3.3 µA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 50 MHz |
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Technical parameters/dissipated power (Max): | 800 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 78 dB |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/military grade: | Yes |
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