Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Obsolete |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TCM320AC36CDW
|
TI | 功能相似 | SOIC |
语音频带音频处理器VBAPE VOICE-BAND AUDIO PROCESSORS VBAPE
|
||
TCM320AC36CDWR
|
TI | 功能相似 | SOIC |
语音频带音频处理器VBAPE VOICE-BAND AUDIO PROCESSORS VBAPE
|
||
TCM320AC36IDWR
|
TI | 功能相似 | SOIC |
语音频带音频处理器VBAPE VOICE-BAND AUDIO PROCESSORS VBAPE
|
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