Technical parameters/rated voltage (DC): | 3.30 V |
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Technical parameters/operating voltage: | 3.3 V |
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Technical parameters/capacitance: | 8 pF |
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Technical parameters/rated power: | 500 W |
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Technical parameters/breakdown voltage: | 3.5 V |
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Technical parameters/number of circuits: | 4 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 500 W |
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Technical parameters/clamp voltage: | 15 V |
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Technical parameters/peak pulse power: | 500 W |
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Technical parameters/minimum reverse breakdown voltage: | 3.5 V |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.65 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Computers & Computer Peripherals, Computers and computer peripherals, Imaging, Video& Vision, Video and Visual, Industrial, General, Communication and Network, Imaging, Communications& Networking |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2014/06/16 Alternative material
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