Chip AI consultant
Technical parameters/power supply voltage (DC): | 1.65V ~ 3.60V |
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Technical parameters/number of output interfaces: | 4 |
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Technical parameters/output current: | 24.0 mA |
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Technical parameters/number of channels: | 4 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/digits: | 4 |
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Technical parameters/transmission delay time: | 8.10 ns |
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Technical Parameters/Voltage Wave Node: | 3.30 V, 2.70 V, 2.50 V, 1.80 V |
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Technical parameters/dissipated power: | 0.5 W |
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Technical parameters/bandwidth: | 100 MHz |
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Technical parameters/output current drive: | -1.00 mA |
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Technical parameters/number of inputs: | 8 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 500 mW |
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Technical parameters/power supply voltage: | 2V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 1.65 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | TSSOP-16 |
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Dimensions/Packaging: | TSSOP-16 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Aviation electronics, automotive, military and aviation, defense, medical |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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