Technical parameters/power supply voltage (DC): | 2.50V (min) |
| ||||||
Technical parameters/rise/fall time: | 2.5 ns |
| ||||||
Technical parameters/output current: | 10 mA |
| ||||||
Technical parameters/number of channels: | 6 |
| ||||||
Technical parameters/number of pins: | 16 |
| ||||||
Technical parameters/dissipated power: | 415 mW |
| ||||||
Technical parameters/data rate: | 150 Mbps |
| ||||||
Technical parameters/rise time: | 4 ns |
| ||||||
Technical parameters/isolation voltage: | 5000 Vrms |
| ||||||
Technical parameters/input current (Min): | 9.1 mA |
| ||||||
Technical parameters/forward voltage (Max): | 5.5 V |
| ||||||
Technical parameters/descent time (Max): | 4 ns |
| ||||||
Technical parameters/rise time (Max): | 4 ns |
| ||||||
Technical parameters/operating temperature (Max): | 125 ℃ |
| ||||||
Technical parameters/operating temperature (Min): | -40 ℃ |
| ||||||
Technical parameters/dissipated power (Max): | 415 mW |
| ||||||
Technical parameters/power supply voltage: | 2.5V ~ 5.5V |
| ||||||
Technical parameters/power supply voltage (Max): | 5.5 V |
| ||||||
Technical parameters/power supply voltage (Min): | 2.5 V |
| ||||||
Encapsulation parameters/installation method: | Surface Mount |
| ||||||
Package parameters/number of pins: | 16 |
| ||||||
Encapsulation parameters/Encapsulation: | SOIC-16 |
| ||||||
Dimensions/Length: | 10.3 mm |
| ||||||
Dimensions/Width: | 2.65 mm |
| ||||||
Dimensions/Packaging: | SOIC-16 |
| ||||||
Physical parameters/operating temperature: | -40℃ ~ 125℃ |
| ||||||
Other/Product Lifecycle: | Active |
| ||||||
Other/Packaging Methods: | Cut Tape (CT) |
| ||||||
Other/Manufacturing Applications: | Power Management, Industrial, Power management, Automotive, Medical, Industrial, Alternative material
Newly listed productsVideo playback©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd. |
The most helpful review