Encapsulation parameters/Encapsulation: | BGA |
|
Dimensions/Packaging: | BGA |
|
Other/Product Lifecycle: | Obsolete |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ON Semiconductor | 功能相似 | BGA |
MCU 32Bit e200 RISC 448KB Flash 5V Automotive 272Pin BGA Tray
|
||
MPC555LFMVR40
|
Freescale | 功能相似 | BGA-272 |
MCU 32Bit e200 RISC 448KB Flash 5V Automotive 272Pin BGA Tray
|
||
MPC555LFMVR40
|
NXP | 功能相似 | BGA-272 |
MCU 32Bit e200 RISC 448KB Flash 5V Automotive 272Pin BGA Tray
|
||
|
|
Motorola | 类似代替 | BGA |
微控制器, MPC5 Family MPC55xx Series Microcontrollers, 电源架构, 32位, 40 MHz, 448 KB, 26 KB
|
||
MPC555LFMZP40
|
Freescale | 类似代替 | BGA-272 |
微控制器, MPC5 Family MPC55xx Series Microcontrollers, 电源架构, 32位, 40 MHz, 448 KB, 26 KB
|
||
MPC555LFMZP40
|
NXP | 类似代替 | BGA-272 |
微控制器, MPC5 Family MPC55xx Series Microcontrollers, 电源架构, 32位, 40 MHz, 448 KB, 26 KB
|
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