Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
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Other/Product Lifecycle: | Unknown |
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Compliant with standards/RoHS standards: | Non-Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT1764EFE-2.5#PBF
|
Linear Technology | 功能相似 | TSSOP-16 |
IC REG LDO 2.5V 3A 16TSSOP
|
||
|
|
ADI | 功能相似 | TSSOP |
IC REG LDO 2.5V 3A 16TSSOP
|
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