Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 3 |
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Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Packaging: | SMD |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM1086IS-1.8/NOPB
|
National Semiconductor | 功能相似 | TO-263 |
TEXAS INSTRUMENTS LM1086IS-1.8/NOPB 固定电压稳压器, LDO, 2.6V至27V, 1.3V压差, 1.8V输出, 1.5A输出, TO-263-3
|
||
LM1086IS-1.8/NOPB
|
TI | 功能相似 | TO-263-4 |
TEXAS INSTRUMENTS LM1086IS-1.8/NOPB 固定电压稳压器, LDO, 2.6V至27V, 1.3V压差, 1.8V输出, 1.5A输出, TO-263-3
|
||
LM1086ISX-1.8/NOPB
|
TI | 功能相似 | TO-263-4 |
1.5A,1.8V固定输出,低压降正电压稳压器
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