Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90CF386MTD/NOPB
|
TI | 功能相似 | TSSOP-56 |
TEXAS INSTRUMENTS DS90CF386MTD/NOPB. 芯片, 线接收器, LVDS
|
||
DS90CR286AMTD/NOPB
|
TI | 功能相似 | TSSOP-56 |
TEXAS INSTRUMENTS DS90CR286AMTD/NOPB 芯片, 线接收器, LVDS
|
||
DS90CR286AMTD/NOPB
|
National Semiconductor | 功能相似 | TSSOP-56 |
TEXAS INSTRUMENTS DS90CR286AMTD/NOPB 芯片, 线接收器, LVDS
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review