Chip AI consultant
Technical parameters/rise/fall time: | 2µs, 3µs |
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Technical parameters/output voltage: | 80.0 V |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/input current: | 50 mA |
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Technical parameters/dissipated power: | 200 mW |
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Technical parameters/rise time: | 2 µs |
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Technical parameters/isolation voltage: | 3 kV |
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Technical parameters/forward current: | 50 mA |
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Technical parameters/output voltage (Max): | 80 V |
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Technical parameters/input current (Min): | 50 mA |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 3 µs |
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Technical parameters/operating temperature (Max): | 110 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 200 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 2 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -55℃ ~ 110℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | System appliances, measuring , Computers and computer peripherals, signal processing, Signal Processing, I/O Interface for Programmable controllers, computers., Test & Measurement, Sequence , Communication and Networks, Signal transmission between circuits of different potentials and impedances., Communi Alternative material
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