Chip AI consultant
Technical parameters/output voltage: | 80.0 V |
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Technical parameters/forward voltage: | 1.2 V |
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Technical parameters/input current: | 20.0 mA |
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Technical parameters/dissipated power: | 200 mW |
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Technical parameters/isolation voltage: | 3 kV |
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Technical parameters/input current (Min): | 50 mA |
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Technical parameters/forward voltage (Max): | 1.4 V |
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Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 3 µs |
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Technical parameters/operating temperature (Max): | 110 ℃ |
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Technical parameters/operating temperature (Min): | -55 ℃ |
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Technical parameters/dissipated power (Max): | 200 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | SSOP-4 |
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Dimensions/Length: | 2.6 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 2 mm |
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Dimensions/Packaging: | SSOP-4 |
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Physical parameters/operating temperature: | -55℃ ~ 110℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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