Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 28 |
|
Encapsulation parameters/Encapsulation: | SSOP |
|
Dimensions/Length: | 10.2 mm |
|
Dimensions/Width: | 5.3 mm |
|
Dimensions/Packaging: | SSOP |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ADI | 功能相似 | SSOP |
DC-DC电源芯片 LTC3826EG-1#PBF SSOP-28-208mil
|
||
LTC3826EG-1#PBF
|
Linear Technology | 功能相似 | SSOP-28 |
DC-DC电源芯片 LTC3826EG-1#PBF SSOP-28-208mil
|
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