Chip AI consultant
Technical parameters/frequency: | 1.00 MHz |
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Technical parameters/power supply voltage (DC): | 0.00V(min), 10.0V(max) |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/output voltage: | 1.00 V |
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Technical parameters/output current: | 1 A |
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Technical parameters/power supply current: | 1.2 mA |
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Technical parameters/dissipated power: | 0.65 W |
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Technical parameters/adjusted output: | 1 |
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Technical parameters/rise time: | 41 ns |
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Technical parameters/switching frequency: | 1 MHz |
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Technical parameters/topology structure: | Boost, Flyback, Forward |
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Technical parameters/duty cycle: | 50 % |
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Technical parameters/maximum duty cycle: | 50 % |
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Technical parameters/descent time: | 44 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 650 mW |
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Technical parameters/power supply voltage: | 8.3V ~ 10V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UCC2813DTR-0
|
TI | 完全替代 | SOIC-8 |
低功耗经济型BiCMOS电流模式PWM Low Power Economy BiCMOS Current Mode PWM
|
||
UCC2813DTR-2
|
TI | 完全替代 | SOIC-8 |
低功耗经济型BiCMOS电流模式PWM Low Power Economy BiCMOS Current Mode PWM
|
||
UCC2813DTR-3
|
TI | 完全替代 | SOIC-8 |
低功耗经济型BiCMOS电流模式PWM Low Power Economy BiCMOS Current Mode PWM
|
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