Chip AI consultant
Technical parameters/operating voltage: | 5.5 V |
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Technical parameters/capacitance: | 1.5 pF |
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Technical parameters/number of output interfaces: | 2 |
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Technical parameters/breakdown voltage: | 11 V |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 5 |
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Technical parameters/clamp voltage: | 105.5 V |
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Technical parameters/minimum reverse breakdown voltage: | 11 V |
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Technical parameters/Input voltage (Max): | 15000 V |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 0.9.5.5 V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 5 |
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Encapsulation parameters/Encapsulation: | SOT-553 |
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Dimensions/Length: | 1.6 mm |
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Dimensions/Width: | 1.2 mm |
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Dimensions/Height: | 0.55 mm |
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Dimensions/Packaging: | SOT-553 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Testing and Measurement, Medical, Communication and Networking, Ethernet |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | 2014/12/17 |
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Customs information/ECCN code: | EAR99 |
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPD2E001DRYRG4
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TI | 类似代替 | SON-6 |
低电容2通道± 15千伏ESD保护阵列高速数据接口 LOW-CAPACITANCE 2-CHANNEL ±15-kV ESD-PROTECTION ARRAY FOR HIGH-SPEED DATA INTERFACES
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