Chip AI consultant
Technical parameters/output current: | ≤50 mA |
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Technical parameters/power supply current: | 800 µA |
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Technical parameters/number of circuits: | 4 |
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Technical parameters/number of channels: | 4 |
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Technical parameters/dissipated power: | 700 mW |
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Technical parameters/Common Mode Rejection Ratio: | 70dB ~ 83dB |
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Technical parameters/input compensation drift: | 2.00 µV/K |
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Technical parameters/bandwidth: | 670 kHz |
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Technical parameters/conversion rate: | 550 mV/μs |
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Technical parameters/gain bandwidth product: | 710 kHz |
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Technical parameters/Over temperature protection: | No |
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Technical parameters/input compensation voltage: | 300 µV |
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Technical parameters/input bias current: | 1 pA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/gain bandwidth: | 710 kHz |
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Technical parameters/dissipated power (Max): | 700 mW |
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Technical parameters/Common Mode Rejection Ratio (Min): | 70 dB |
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Technical parameters/power supply voltage (Max): | 8 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 14 |
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Encapsulation parameters/Encapsulation: | TSSOP-14 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 1.15 mm |
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Dimensions/Packaging: | TSSOP-14 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TLV2264IPWR
|
TI | 类似代替 | TSSOP-14 |
高级LinCMOS轨到轨运算放大器 Advanced LinCMOS RAIL-TO-RAIL OPERATIONAL AMPLIFIERS
|
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