Chip AI consultant
Technical parameters/frequency: | 30 MHz |
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Technical parameters/number of output interfaces: | 8 |
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Technical parameters/Input voltage (DC): | 3.00V ~ 5.50V |
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Technical parameters/output voltage: | 17 V |
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Technical parameters/output current: | 120 mA |
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Technical parameters/power supply current: | 22000 mA |
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Technical parameters/dissipated power: | 600 W |
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Technical parameters/Static current: | 6.00 mA |
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Technical parameters/switching frequency: | 30 MHz |
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Technical parameters/Input voltage (Max): | 5.5 V |
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Technical parameters/input voltage (Min): | 3 V |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 600 mW |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Technical parameters/input voltage: | 3V ~ 5.5V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ (TA) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | sign |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standard/REACH SVHC version: |
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