Chip AI consultant
Technical parameters/frequency: | 67 kHz |
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Technical parameters/power supply voltage (DC): | 8.75V (min) |
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Technical parameters/halogen-free state: | Halogen Free |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 800 mW |
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Technical parameters/switching frequency: | 60.3kHz ~ 73.7kHz |
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Technical parameters/topology structure: | Step-Up |
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Technical parameters/thermal resistance: | 100 ℃/W |
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Technical parameters/duty cycle: | 94 % |
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Technical parameters/maximum duty cycle: | 94 % |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 8.75V ~ 18V |
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Technical parameters/power supply voltage (Max): | 18 V |
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Technical parameters/power supply voltage (Min): | 8.75 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Power Factor Correction Stage |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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